ESMT
F25L004A
Operation Temperature Condition -40°C ~85°C
ELECTRICAL SPECIFICATIONS
Absolute Maximum Stress Ratings
(Applied conditions greater than those listed under “Absolute Maximum Stress Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at these conditions or conditions greater than those defined in the
operational sections of this data sheet is not implied. Exposure to absolute maximum stress rating conditions may affect device
reliability.)
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65°C to +150°C
D. C. Voltage on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to VDD+0.5V
Transient Voltage (<20 ns) on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . . . . . . -2.0V to VDD+2.0V
Package Power Dissipation Capability (Ta = 25°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0W
Surface Mount Lead Soldering Temperature (3 Seconds) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 240°C
Output Short Circuit Current (Note1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA
Note：
1. Output shorted for no more than one second. No more than one output shorted at a time.
AC CONDITIONS OF TEST
Input Rise/Fall Time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . <5 ns
Output Load . . . . . . . . . . . . . . . . . . . . . . . . CL = 15 pF for ≧75MHz
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .CL = 30 pF for ≦50MHz
See Figures 23 and 24
OPERATING RANGE
Parameter
Symbol
VDD (for FCLK ≦ 75MHz)
VDD (for FCLK = 100MHz)
TA
Value
2.7~3.6
3.0~3.6
-40~85
Unit
V
Operating Supply Voltage
Ambient Operating Temperature
°C
TABLE 6: DC OPERATING CHARACTERISTICS
Limits
Max
15
Symbol
Parameter
Read Current
Test Conditions
Min
Units
mA
IDDR
IDDW
ISB
CE =0.1 VDD/0.9 VDD@33 MHz, SO=open
CE =VDD
Program and Erase Current
Standby Current
40
75
mA
µA
CE =VDD, VIN=VDD or VSS
VIN=GND to VDD, VDD=VDD Max
VOUT=GND to VDD, VDD=VDD Max
VDD=VDD Min
DD=VDD Max
IOL=100 µA, VDD=VDD Min
OH=-100 µA, VDD=VDD Min
ILI
ILO
VIL
VIH
VOL
VOH
Input Leakage Current
Output Leakage Current
Input Low Voltage
Input High Voltage
Output Low Voltage
Output High Voltage
1
1
0.8
µA
µA
V
V
V
0.7 VDD
VDD-0.2
V
0.2
V
I
TABLE 7 : RECOMMENDED SYSTEM POWER-UP TIMINGS
Symbol
Parameter
Minimum
Units
µs
µs
1
TPU-READ
VDD Min to Read Operation
VDD Min to Write Operation
10
10
1
TPU-WRITE
1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter.
TABLE 8: CAPACITANCE (TA = 25°C, f=1 Mhz, other pins open)
Parameter
COU1T
CIN
Description
Test Condition
VOUT = 0V
Maximum
12 pF
1
Output Pin Capacitance
Input Capacitance
VIN = 0V
6 pF
1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter.
Elite Semiconductor Memory Technology Inc.
Publication Date: Jan. 2009
Revision: 1.3 23/33
ESMT [ ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC. ]
