EN25P05
PACKAGE MECHANICAL
Figure 24. SOP 8 ( 150 mil )
b
e
Detail A
Detail A
DIMENSION IN MM
SYMBOL
MIN.
1.35
0.10
- - -
NOR
- - -
- - -
- - -
- - -
- - -
- - -
1.27
- - -
- - -
- - -
MAX
A
A1
A2
D
1.75
0.25
1.50
5.00
6.20
4.00
- - -
4.80
5.80
3.80
- - -
E
E1
e
b
0.33
0.4
00
0.51
1.27
80
L
θ
Note : 1. Coplanarity: 0.1 mm
2. Max. allowable mold flash is 0.15 mm
at the pkg ends, 0.25 mm between leads.
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
©2004 Eon Silicon Solution, Inc., www.essi.com.tw
27
Rev. C, Issue Date: 2008/01/17
ESMT [ ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC. ]
