Ericsson Internal
PRODUCT SPECIFICATION
3 (5)
E
Prepared (also subject responsible if other)
No.
MICUPEZ
4/1301-BMR 637 02 Uen
269
Technical Specification
Approved
Checked
Date
Rev
Reference
EN/LZT 146 306 R4A July 2008
PJKuMlia Y4o0u0(0SDH/PSEINCB) Series
DC/DC converters, Input 36-75 V, Output 40 A/132 W
2006-11-21
C
© Ericsson Power Modules AB
Soldering Information — Through Hole Mounting
The product is intended for through hole mounting in a PCB.
When wave soldering is used, the temperature on the pins is
specified to maximum 260 °C for maximum 10 seconds.
Maximum preheat rate of 4 °C/s and temperature of max
150 °C is suggested. When hands soldering care should be
taken to avoid direct contact between the hot soldering iron
tip and the pins for more than a few seconds in order to
prevent overheating.
A no-clean (NC) flux is recommended to avoid entrapment of
cleaning fluids in cavities inside of the DC/DC power module.
The residues may affect long time reliability and isolation
voltage.
Delivery package information
The products are delivered in antistatic trays.
Tray specifications
PS, dissipative
Material
10E5 to 10E12 ohms/square
20 converters/tray
140 g empty, 940 g full
20 converters
Surface resistance
Tray capacity
Tray weight
Box capacity