Ericsson Internal
PRODUCT SPECIFICATION
3 (5)
E
Prepared (also subject responsible if other)
No.
MICMALE
3/1301-BMR 658 Uen
19
Technical Specification
Approved
Checked
Date
Rev
Reference
EN/LZT 146 384 R4A
May 2013
PSKEBC/4D0B0e0ttBy Wsueries Intermediate Bus(ECZHonEvWeNrGte)rs2009-12-16
Input 36-75 V, Output up to 40 A / 252 W
PB3
© Ericsson AB
Thermal Consideration
General
The products are designed to operate in different thermal
environments and sufficient cooling must be provided to
ensure reliable operation.
For products mounted on a PCB without a heat sink attached
cooling is achieved mainly by conduction, from the pins to the
host board, and convection, which is dependant on the airflow
across the product. Increased airflow enhances the cooling of
the converter.
The Output Current Derating graph found in the Output section
for each model provides the available output current vs.
ambient air temperature and air velocity at Vin = 53 V.
The product is tested on a 254 x 254 mm,
35 µm (1 oz), 16-layer test board mounted vertically in a wind
tunnel with a cross-section of 305 x 305 mm.
Proper cooling of the DC/DC converter can be verified by
measuring the temperature at positions P1, P2, P3, P4 and
P5. The temperature at these positions should not exceed the
max values provided in the table below. The number of points
may vary with different thermal design and topology.
Base plate
See Design Note 019 for detailed information.
Position
P1
P2
P3
P5
Description
Max value
125 ºC
125 ºC
100 ºC
125 ºC
125 ºC
105 ºC
Reference point (Tref
Transistor
Optocoupler
Reference point (Tref
Transistor
Base plate
)
)
P6
P7
Open frame
ERICSSON [ ERICSSON ]
