PBL 3764A/4, /6
Pin Description
Refer to figure 8. Note: all pin number references in the text and figures refer to the 22-pin DIP unless otherwise specified.
DIP PLCC Symbol
Description
1
RINGSense RINGXSense is internally connected to RINGX. RINGXSense is used during manufacturing, but require no
connections in SLIC applications, i.e. leave open.
7
2
3
4
5
6
7
BGND
VBAT
VCC
Ground. Should be tied together with AGND (pin 18).
These pins marked VBAT are used for heat sinking and internally connected to VBAT
+5V power supply
8
9
RINGRLY Ring relay driver output. Open collector. Sinks 50 mA to GND.
10
11
VBAT
RSG
Battery supply voltage, -24V to -58V. Negative with respect to GND (pins 7, 18).
The internal saturation guard programming resistor, RSG, connects from this terminal to VEE (pin 20). Refer
to section "Battery feed" for detailed information.
12
13
8
9
E1
E0
TTL compatible enable input. Enables desired detector to be gated to the DET (pin 14) output. Refer to
section "Enable inputs" for detailed information.
TTL compatible enable input. Enables the DET (pin 14) output when set to logic level low and disables the
DET output when set to logic level high. Refer to section "Enable inputs" for detailed information.
10
VBAT
DET
These pins marked VBAT are used for heat sinking and internally connected to VBAT.
14 11
Detector output. Inputs C1 (pin 16) and C2 (pin 15) together with enable inputs E0 (pin 13) and E1 (pin 12)
select one of the three detectors to be connected to the DET output. A logic low at the enabled DET output
indicates a triggered detector condition. The DET output is open collector with internal pull-up resistor
(approximately 15 kΩ to VCC (pin 8)).
15 12
16 13
17 14
C2
C1 and C2 are TTL compatible inputs controlling the SLIC operating states.
Refer to section "Control inputs" for details.
C1
RDC
Constant current feed is programmed by two resistors connected in series from this pin to the receive
summing node (RSN, pin 19). The resistor junction point is decoupled to GND to isolate the ac signal
components.
18 15
19 16
AGND
RSN
Ground. Should be tied together with BGND (pin 7).
Receive summing node. 1000 times the current (dc and ac) flowing into this pin equals the metallic
(transversal) current flowing from RINGX (pin 6) to TIPX (pin 5). Programming networks for constant current
feed, two-wire impedance and receive gain connect to the receive summing node.
17
20 18
21 19
VBAT
VEE
VTX
These pins marked VBAT are used for heat sinking and internally connected to VBAT.
-5V power supply.
Transmit vf output. The ac voltage difference between TIPX (pin 5) and RINGX (pin 6), the ac metallic
voltage, is reproduced as an unbalanced GND referenced signal at VTX with a gain of one. The two-wire
impedance programming network connects between VTX and RSN (pin 19).
22 20
HPT
HPR
RD
TIP side of ac/dc separation capacitor CHP. Other end of CHP capacitor connects to pin 1, HPR.
Ring side of ac/dc separation capacitor CHP. Other end of CHP connects to pin 22, HPT.
Off-hook detector programming resistor RD in parallel with filter capacitor CD connect from RD to VEE.
1
2
3
21
22
23
DT
Inputs to the ring trip comparator. With DR more positive than DT the detector output, DET (pin 14), is at
logic level low, indicating off-hook condition. The ring trip network connects to these two inputs.
24
25
VBAT
DR
These pins marked VBAT are used for heat sinking and internally connected to VBAT.
4
Inputs to the ring trip comparator. With DR more positive than DT the detecor output, DET (pin 14), is at
logic level low, indicating off-hook condition. The ring trip network connects to these two inputs.
26
TIPXSense TIPXSense is internally connected to TIPX. TIPXSense is used during manufacturing, but require no connections
in SLIC applications, i.e. leave open.
27
28
TIPX
RINGX
The TIPX and RINGX pins connect to the tip and ring leads of the two-wire interface via overvoltage
protection components and ring relay (and optional test relays).
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9
ERICSSON [ ERICSSON ]
