S1D15E06 Series
4. PIN ASSIGNMENT
4.1 Chip Assignment
98
1
99
412
D15E6D1B
Die No.
S1D15E06 Series
(0, 0)
345
166
167
344
Size
Y
Item
Unit
X
Chip size
Chip thickness
Bump pitch
10.26
×
3.98
mm
mm
µm
0.4/0.625
50 (Min.)
Bump size PAD No.1 to 98
PAD No.99 to 166, 345 to 412
70
116
61
×
×
×
×
92
33
61
116
µm
µm
µm
µm
PAD No.167 to 175, 336 to 344
PAD No.176 to 335
33
Bump height
22.5 (Typ.)
µm
4.2 Alignment mark
Alignment coordinate
1(–4761.4, 1830.0) µm
2( 4926.0, –1819.1) µm
Mark size
b
a
a = 80 µm
b = 20 µm
Rev. 2.1
EPSON
3