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CT0603L25HSG 参数 Datasheet PDF下载

CT0603L25HSG图片预览
型号: CT0603L25HSG
PDF下载: 下载PDF文件 查看货源
内容描述: 金属氧化物压敏电阻SMD压敏电阻多层膜与镍屏障终止 [Metal Oxide Varistors SMD multilayer varistor with Ni-barrier termination]
分类和应用: 压敏电阻
文件页数/大小: 7 页 / 138 K
品牌: EPCOS [ EPCOS ]
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Metal Oxide Varistors
SMD multilayer varistor with Ni-barrier termination
CT0603L25HSG
B72500T8250L060
Recommended geometry of solder pad
B
A
D
C
B
A = 1.0 mm
B = 1.0 mm
C = 1.0 mm
E = 3.0 mm
A
Recommended soldering temperature profile
Soldering zone
max. 7 s
at max. temp.
Preheating zone
max. 2 C/s
300
C
T
245
215
180
100 s
Cooling-down zone
max. 2 C/s
(natural air cooling)
40 s
Soldering zone
max. 5 s
at max. temp.
10 s
Preheating zone
max. 2 C/s
300
C
T
260
235
200
1st solder
wave
Cooling-down zone
max. 5 C/s (natural air cooling)
2nd solder
wave
130
100
100
20
0
50
100
150
200
s
t
VAR0543-W-E
20
250
0
50
100
150
200
s
t
250
VAR0550-F-E
This component should be soldered within 12 months after delivery from EPCOS. They
should be left in their original packings to avoid soldering problems due to oxidized terminals.
Storage temperature:
-25
to 45 °C
Relative humidity: < 75% annual average, < 95% on maximum 30 days in a year.
The usage of mild non-activated fluxes for soldering is recommended, as well as proper
cleaning of the PCB.
The components are suited for Pb-free soldering.
ISSUE DATE
28.01.2005
ISSUE
f
PUBLISHER
KB VS PE
PAGE
5/7