CeraDiodes
High-speed series
Soldering directions
1
Reflow soldering temperature profile
Recommended temperature characteristic for reflow soldering following
JEDEC J-STD-020D
Profile feature
Preheat and soak
- Temperature min
- Temperature max
- Time
Average ramp-up rate
Liquidous temperature
Time at liquidous
Peak package body temperature
Time (t
P
)
3)
within 5
°C
of specified
classification temperature (T
c
)
Average ramp-down rate
Time 25
°C
to peak temperature
Sn-Pb eutectic assembly
T
smin
T
smax
t
smin
to t
smax
T
smax
to T
p
T
L
t
L
T
p1)
100
°C
150
°C
60 ... 120 s
3
°C/
s max.
183
°C
60 ... 150 s
220
°C
... 235
°C
2)
20 s
3)
T
p
to T
smax
6
°C/
s max.
maximum 6 min
Pb-free assembly
150
°C
200
°C
60 ... 180 s
3
°C/
s max.
217
°C
60 ... 150 s
245
°C
... 260
°C
2)
30 s
3)
6
°C/
s max.
maximum 8 min
1) Tolerance for peak profile temperature (T
P
) is defined as a supplier minimum and a user maximum.
2) Depending on package thickness. For details please refer to JEDEC J-STD-020D.
3) Tolerance for time at peak profile temperature (t
P
) is defined as a supplier minimum and a user maximum.
Note:
All temperatures refer to topside of the package, measured on the package body surface.
Number of reflow cycles: 3
Please read
Cautions and warnings
and
Important notes
at the end of this document.
Page 12 of 22
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