Multilayer varistors (MLVs)
High-speed series
Recommended solder pad layout
Single chip
2-fold array
4-fold array
Dimensions in mm
Case size
EIA / mm
0201 / 0603
0402 / 1005
0603 / 1608
0405 / 1014
0508 / 1220
0612 / 1632
Single chip
Single chip
Single chip
2-fold array
4-fold array
4-fold array
A
0.30
0.60
1.00
0.40
0.35
0.50
B
0.25
0.60
1.00
0.55
0.90
0.70
C
0.30
0.50
1.00
0.28
0.40
1.20
E
-
-
-
0.64
0.50
0.76
Delivery mode
EIA case size Taping
2-fold array
0405
0405
4-fold array
0508
0612
Single chip
0201
0402
0402
0603
0603
Reel size Packing unit Type
mm
pcs.
5000
5000
4000
3000
15000
10000
10000
4000
4000
CA04P2S14THSG
CA04P2V150THSG
CA05P4S14THSG
CA06P4V150THSG
CT0201S4AHSG
CT0402S14AHSG
CT0402V150HSG
CT0603L25HSG
CT0603S14AHSG
Ordering code
Cardboard 180
Cardboard 180
Cardboard 180
Blister
180
Cardboard
Cardboard
Cardboard
Cardboard
Cardboard
180
180
180
180
180
B72762A8140S160
B72762A8251V060
B72714A8140S160
B72724A8151V062
B72440T8040S160
B72590T8140S160
B72590T8151V060
B72500T8250L060
B72500T8140S160
Please read
Cautions and warnings
and
Important notes
at the end of this document.
Page 7 of 28
EPCOS [ EPCOS ]
