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B72590T7271V060 参数 Datasheet PDF下载

B72590T7271V060图片预览
型号: B72590T7271V060
PDF下载: 下载PDF文件 查看货源
内容描述: 陶瓷瞬态电压抑制器 [Ceramic transient voltage suppressors]
分类和应用:
文件页数/大小: 26 页 / 615 K
品牌: EPCOS [ EPCOS ]
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Multilayer varistors (MLVs)  
Radio frequency series  
5
Conductive adhesion  
Attaching surface-mounted devices (SMDs) with electrically conductive adhesives is a commer-  
cially attractive method of component connection to supplement or even replace conventional sol-  
dering methods.  
Electrically conductive adhesives consist of a non-conductive plastic (epoxy resin, polyimide or  
silicon) in which electrically conductive metal particles (gold, silver, palladium, nickel, etc) are em-  
bedded. Electrical conduction is effected by contact between the metal particles.  
Adhesion is particularly suitable for meeting the demands of hybrid technology. The adhesives  
can be deposited ready for production requirements by screen printing, stamping or by dis-  
pensers. As shown in the following table, conductive adhesion involves two work operations fewer  
than soldering.  
Reflow soldering  
Screen-print solder paste  
Mount SMD  
Wave soldering  
Apply glue dot  
Mount SMD  
Cure glue  
Conductive adhesion  
Screen-print conductive adhesive  
Mount SMD  
Predry solder paste  
Reflow soldering  
Wash  
Cure adhesive  
Wave soldering  
Wash  
Inspect  
Inspect  
Inspect  
A further advantage of adhesion is that the components are subjected to virtually no temperature  
shock at all. The curing temperatures of the adhesives are between 120 °C and 180 °C, typical  
curing times are between 30 minutes and one hour.  
The bending strength of glued chips is, in comparison with that of soldered chips, higher by a fac-  
tor of at least 2, as is to be expected due to the elasticity of the glued joints.  
The lower conductivity of conductive adhesive may lead to higher contact resistance and thus re-  
sult in electrical data different to those of soldered components. Users must pay special attention  
to this in RF applications.  
Please read Cautions and warnings and  
Important notes at the end of this document.  
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