Multilayer varistors (MLVs)
Automotive series
2.3
Lead-free soldering processes
EPCOS multilayer CTVS with AgNiSn termination are designed for the requirements of lead-free
soldering processes only.
Soldering temperature profiles to JEDEC J-STD-020D, IEC 60068-2-58 and ZVEI recommenda-
tions.
3
Recommended soldering methods - type-specific releases by EPCOS
Overview
3.1
Reflow soldering
SnPb
Wave soldering
SnPb
Type
Case size
Lead-free
Approved
Approved
No
Lead-free
No
CT... / CD...
CT... / CD...
CN...
0201/ 0402
Approved
No
0603 ... 2220 Approved
0603 ... 2220 Approved
Approved
Approved
No
Approved
No
CN...K2
Arrays
1812, 2220
Approved
Approved
Approved
Approved
Approved
No
No
0405 ... 1012 Approved
No
No
ESD/EMI filters 0405, 0508
Approved
Approved
No
No
No
CU
3225, 4032
-
Approved
Approved
Approved
Approved
SHCV
3.2
Nickel barrier and AgPt terminated multilayer CTVS
All EPCOS MLVs with nickel barrier and AgPt termination are suitable and fully qualiyfied for lead-
free soldering. The nickel barrier layer is 100% matte tin-plated.
3.3
Silver-palladium terminated MLVs
AgPd-terminated MLVs are mainly designed for conductive adhesion technology on hybrid materi-
al. Additionally MLVs with AgPd termination are suitable for reflow and wave soldering with SnPb
solder.
Note:
Lead-free soldering is not approved for MLVs with AgPd termination.
3.4
Silver-platinum terminated MLVs
The silver-platinum termination is approved for reflow soldering, SnPb soldering and lead-free
with a silver containing solder paste. In case of SnPb soldering, a solder paste Sn62Pb36Ag2 is
recommended. For lead-free reflow soldering, a solder paste SAC, e.g. Sn95.5Ag3.8Cu0.7, is
recommended.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 60 of 72
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