Multilayer varistors (MLVs)
Automotive series
3
Recommended soldering methods - type-specific releases by EPCOS
Overview
3.1
Reflow soldering
SnPb
Wave soldering
SnPb
Type
Case size
Lead-free
Approved
Approved
No
Lead-free
No
CT... / CD...
CT... / CD...
CN...
0201/ 0402
Approved
No
0603 ... 2220 Approved
0603 ... 2220 Approved
0405 ... 1012 Approved
Approved
Approved
No
Approved
No
Arrays
Approved
Approved
Approved
No
No
ESD/EMI filters 0405, 0508
Approved
Approved
No
No
No
CU
3225, 4032
-
Approved
Approved
Approved
Approved
SHCV
3.2
Nickel barrier terminated multilayer CTVS
All EPCOS MLVs with nickel barrier termination are suitable and fully qualiyfied for lead-free sol-
dering. The nickel barrier layer is 100% matte tin-plated.
3.3
Silver-palladium terminated MLVs
AgPd-terminated MLVs are mainly designed for conductive adhesion technology on hybrid materi-
al. Additionally MLVs with AgPd termination are suitable for reflow and wave soldering with SnPb
solder.
Note:
Lead-free soldering is not approved for MLVs with AgPd termination.
3.4
Tinned copper alloy
All EPCOS CU types with tinned termination are approved for lead-free and SnPb soldering.
3.5
Tinned iron wire
All EPCOS SHCV types with tinned termination are approved for lead-free and SnPb soldering.
4
Solder joint profiles / solder quantity
Nickel barrier termination
4.1
If the meniscus height is too low, that means the solder quantity is too low, the solder joint may
break, i.e. the component becomes detached from the joint. This problem is sometimes interpret-
ed as leaching of the external terminations.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 55 of 67
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