Microwave Ceramics and Modules
2 – Pole Filter for W - LAN
Preliminary Data Sheet
Dimension Limits , Marking
Filter
B69812N2457B111
View from below onto the solder terminals and view from beside
Recommended footprint (Same Footprint as for „X“101 and „X“201 WLan-Series )
Solder Pads:
I/O Pads must be
connected to lines with
50
Ω
impedance.
In the application a
termination of 50
Ω
must be realized.
I/O
G
I/O
G
G
Ground, covered with
solder resist, connected
to lower ground plane
by vias with maximum
diameter of 0.3mm and
max. distance of 1mm
ISSUE DATE
20.05.03
ISSUE
P1
PUBLISHER
SAW MWC PD
PAGE
2/4
EPCOS [ EPCOS ]
