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B57871S0103F001 参数 Datasheet PDF下载

B57871S0103F001图片预览
型号: B57871S0103F001
PDF下载: 下载PDF文件 查看货源
内容描述: NTC热敏电阻温度测量 [NTC thermistors for temperature measurement]
分类和应用:
文件页数/大小: 19 页 / 334 K
品牌: EPCOS [ EPCOS ]
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Temperature measurement  
B57871S  
S871  
Leaded NTC thermistors, lead spacing 2.5 mm  
Bending strength: Test Ub:  
Two 90°-bends in opposite directions at a weight of 0.25 kg.  
Torsional strength: Test Uc: severity 2  
The lead is bent by 90° at a distance of 6 to 6.5 mm from the thermistor body.  
The bending radius of the leads should be approx. 0.75 mm. Two torsions of  
180° each (severity 2).  
When subjecting leads to mechanical stress, the following should be observed:  
Tensile stress on leads  
During mounting and operation tensile forces on the leads are to be avoided.  
Bending of leads  
Bending of the leads directly on the thermistor body is not permissible.  
A lead may be bent at a minimum distance of twice the wire's diameter +2 mm from the solder  
joint on the thermistor body. During bending the wire must be mechanically relieved at its outlet.  
The bending radius should be at least 0.75 mm.  
Twisting of leads  
The twisting (torsion) by 180° of a lead bent by 90° is permissible at 6 mm from the bottom of the  
thermistor body.  
4
Sealing and potting  
When thermistors are sealed, potted or overmolded, there must be no mechanical stress caused  
by thermal expansion during the production process (curing / overmolding process) and during  
later operation. The upper category temperature of the thermistor must not be exceeded. Ensure  
that the materials used (sealing / potting compound and plastic material) are chemically neutral.  
5
Cleaning  
If cleaning is necessary, mild cleaning agents such as ethyl alcohol and cleaning gasoline are  
recommended. Cleaning agents based on water are not allowed. Ultrasonic cleaning methods are  
permissible.  
6
Storage  
In order to maintain their solderability, thermistors must be stored in a non-corrosive atmosphere.  
Humidity, temperature and container materials are critical factors.  
Do not store SMDs where they are exposed to heat or direct sunlight. Otherwise, the packing ma-  
terial may be deformed or SMDs may stick together, causing problems during mounting. After  
opening the factory seals, such as polyvinyl-sealed packages, use the SMDs as soon as possible.  
Please read Cautions and warnings and  
Important notes at the end of this document.  
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