Temperature measurement and compensation
SMD NTC thermistors, case size 0805 (2012)
B574**V2
Reflow soldering
Recommended temperature characteristic for reflow soldering following J-STD-020C
Profile feature
Average ramp-up rate
(T
Smax
to Tp)
Preheat
- Temperature min (T
Smin
)
- Temperature max (T
Smax
)
- Time (t
Smin
to t
Smax
)
Time maintained above:
- Temperature min (T
L
)
- Time (t
L
)
Peak/ classification
temperature (T
p
)
Time within 5
°C
of actual
peak temperature (t
p
)
Ramp-down rate
Time 25
°C
to peak
temperature
Sn-Pb eutectic assembly
3
°C/
second max.
100
°C
150
°C
60 ... 120 seconds
183
°C
60 ... 150 seconds
220
°C
... 240
°C
10 ... 30 seconds
6
°C/
second max.
6 minutes max.
Pb-free assembly
3
°C/
second max.
150
°C
200
°C
60 ... 180 seconds
217
°C
60 ... 150 seconds
240
°C
... 260
°C
20 ... 40 seconds
6
°C/
second max.
8 minutes max.
Note:
All temperatures refer to topside of the package, measured on the package body surface.
Please read
Cautions and warnings
and
Important notes
at the end of this document.
Page 12 of 20
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