Temperature measurement and compensation
SMD NTC thermistors, case size 0805 (2012)
B574**V2
Mounting instructions
1
Soldering
1.1
SMD NTC thermistors
SMD NTC thermistors can be provided with a nickel barrier termination or on special request with
silver-palladium termination. The usage of mild, non-activated fluxes for soldering is recommend-
ed as well as a proper cleaning of the PCB.
Nickel barrier termination
The nickel barrier layer of the silver/nickel/tin termination (see figure 1) prevents leaching of the
silver base metalization layer. This allows great flexibility in the selection of soldering parameters.
The tin prevents the nickel layer from oxidizing and thus ensures better wetting by the solder. The
nickel barrier termination is suitable for all commonly-used soldering methods.
Figure 1
SMD NTC thermistors, structure of nickel barrier termination
1.1.1 Solderability (test to IEC 60068-2-58)
Preconditioning: Immersion into flux F-SW 32.
Evaluation criterion: Wetting of soldering areas ≥95%.
Solder
Bath temperature (°C)
215 ±3
Dwell time (s)
SnPb 60/40
3
3
SnAg (3.0 ... 4.0), Cu (0.5 ... 0.9)
245 ±3
1.1.2 Resistance to soldering heat (test to IEC 60068-2-58)
Preconditioning: Immersion into flux F-SW 32.
Evaluation criterion: Leaching of side edges ≤1/3.
Solder
Bath temperature (°C)
Dwell time (s)
SnPb 60/40
260 ꢀ5
260 ꢀ5
10
10
SnAg (3.0 ... 4.0), Cu (0.5 ... 0.9)
Please read Cautions and warnings and
Important notes at the end of this document.
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