Temperature measurement and compensation
SMD NTC thermistors, case size 0603 (1608)
B573**V2
Reflow soldering
Recommended temperature characteristic for reflow soldering following J-STD-020C
Profile feature
Sn-Pb eutectic assembly
Pb-free assembly
Average ramp-up rate
(TSmax to Tp)
3 °C/ second max.
3 °C/ second max.
Preheat
- Temperature min (TSmin
)
100 °C
150 °C
- Temperature max (TSmax
)
150 °C
200 °C
- Time (tSmin to tSmax
)
60 ... 120 seconds
60 ... 180 seconds
Time maintained above:
- Temperature min (TL)
- Time (tL)
183 °C
217 °C
60 ... 150 seconds
60 ... 150 seconds
Peak/ classification
temperature (Tp)
220 °C ... 240 °C
240 °C ... 260 °C
Time within 5 °C of actual
peak temperature (tp)
10 ... 30 seconds
6 °C/ second max.
6 minutes max.
20 ... 40 seconds
6 °C/ second max.
8 minutes max.
Ramp-down rate
Time 25 °C to peak
temperature
Note: All temperatures refer to topside of the package, measured on the package body surface.
Please read Cautions and warnings and
Important notes at the end of this document.
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