B32921C/D ... B32926C/D
X2 / 305 V AC
3
Embedding of capacitors in finished assemblies
In many applications, finished circuit assemblies are embedded in plastic resins. In this case,
both chemical and thermal influences of the embedding ("potting") and curing processes must be
taken into account.
Our experience has shown that the following potting materials can be recommended: non-flexible
epoxy resins with acid-anhydride hardeners; chemically inert, non-conducting fillers; maximum
curing temperature of 100
°C.
Caution:
Consult us first if you wish to embed uncoated types!
Please read
Cautions and warnings
and
Important notes
at the end of this document.
Page 12 of 18
EPCOS [ EPCOS ]
