EN29LV320
Revisions List
Revision No
Description
Date
A
B
Initial Release
2004/12/23
2005/01/07
Correct typo on page 47, dimension E and N corrected
1. Correct WP#/ACC states in User Mode Table on page 10,
2. Some notes for application added.
3. Correct EN29LV320T/B typo in titles of Sector Group
Organization table on page 14.
1. change Vcc condition from 2.7V-3.6V to 3.0V-3.6V for 70ns
read operation
2. remove Icc3 standby current TTL input condition at Table 11
1. Add tRPD parameter in the table on page 34
2. Change the FBGA package dimension to enhance the BGA
substrate and ball strength, the difference is
2.1. Package Thickness A : 1.10 mm to 1.31 mm
2.2. Ball size b : 0.3 mm to 0.4 mm
C
D
2005/01/31
2005/05/31
2006/05/16
E
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
©2004 Eon Silicon Solution, Inc., www.essi.com.tw
49
Rev. E, Issue Date: 2006/05/16
EON [ EON SILICON SOLUTION INC. ]
