EN25F05
In the case of Page Program, if the number of byte after the command is less than 4 (at least 1
data byte), it will be ignored too. In the case of SE and BE, exact 24-bit address is a must, any
less or more will cause the command to be ignored.
All attempts to access the memory array during a Write Status Register cycle, Program cycle or Erase
cycle are ignored, and the internal Write Status Register cycle, Program cycle or Erase cycle continues
unaffected.
Table 4. Instruction Set
Instruction Name
Byte 1
Code
Byte 2
Byte 3
Byte 4
Byte 5
Byte 6
n-Bytes
Write Enable
06h
04h
Write Disable / Exit
OTP mode
Read Status
Register
Write Status
Register
(1)
05h
(S7-S0)
S7-S0
(2)
continuous
continuous
01h
03h
0Bh
A23-A16
A23-A16
A15-A8
A15-A8
A7-A0
A7-A0
(D7-D0)
dummy
D7-D0
(Next byte)
(D7-D0)
Read Data
(Next Byte)
continuous
Fast Read
A23-A16
A23-A16
A23-A16
A15-A8
A15-A8
A15-A8
A7-A0
A7-A0
A7-A0
Next byte
continuous
Page Program
Sector Erase
Block Erase
02h
20h
D8h/ 52h
C7h/ 60h
B9h
Chip Erase
Deep Power-down
(3)
(4)
Release from Deep
Power-down, and
read Device ID
Release from Deep
Power-down
dummy
dummy
dummy
(ID7-ID0)
ABh
00h
01h
(M7-M0)
(ID7-ID0)
(ID7-ID0)
(M7-M0)
Manufacturer/
Device ID
dummy
dummy
90h
(ID15-ID8)
(ID7-ID0) (5)
(M7-M0)
Read Identification
Enter OTP mode
Notes:
9Fh
3Ah
1. Data bytes are shifted with Most Significant Bit first. Byte fields with data in parenthesis “( )” indicate data being read from the
device on the DO pin.
2. The Status Register contents will repeat continuously until CS# terminate the instruction.
3. The Device ID will repeat continuously until CS# terminate the instruction.
4. The Manufacturer ID and Device ID bytes will repeat continuously until CS# terminate the instruction.
00h on Byte 4 starts with MID and alternate with DID, 01h on Byte 4 starts with DID and alternate with MID.
5. (M7-M0) : Manufacturer, (ID15-ID8) : Memory Type, (ID7-ID0) : Memory Capacity
Table 5. Manufacturer and Device Identification
OP Code
ABh
(M7-M0)
(ID15-ID0)
(ID7-ID0)
05h
90h
1Ch
1Ch
05h
9Fh
3110h
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
©2004 Eon Silicon Solution, Inc.,
www.eonssi.com
9
Rev. D, Issue Date: 2010/04/15