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EN5337QI 参数 Datasheet PDF下载

EN5337QI图片预览
型号: EN5337QI
PDF下载: 下载PDF文件 查看货源
内容描述: 3A电压模式同步降压PWM DC -DC转换器集成电感器 [3A Voltage Mode Synchronous Buck PWM DC-DC Converter with Integrated Inductor]
分类和应用: 转换器电感器
文件页数/大小: 12 页 / 271 K
品牌: ENPIRION [ ENPIRION, INC. ]
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EN5337QI  
ripple voltage.  
Recommended Output Capacitors  
1
1
1
1
=
+
+ ... +  
Description  
47uF, 6.3V, 20%  
X5R, 1206  
MFG  
Murata  
P/N  
ZTotal Z1 Z2  
Zn  
GRM31CR60J476ME19L  
Taiyo Yuden  
Murata  
JMK212BJ476ML-T  
(1 capacitor needed)  
10uF, 6.3V, 10%  
X5R, 0805  
Typical Ripple Voltages  
GRM21BR60J106KE19L  
Typical Output Ripple (mVp-p)  
(as measured on EN5335QI  
Evaluation Board)  
(Optional 1 capacitor in  
parallel with 47uF above)  
Taiyo Yuden  
JMK212BJ106KG-T  
Output Capacitor  
Configuration  
Power-Up Sequencing  
1 x 47 uF  
30  
15  
47 uF + 10 uF  
During power-up, ENABLE should not be  
asserted before PVIN, and PVIN should not be  
asserted before AVIN. Tying all three pins  
together meets these requirements.  
Thermal Considerations  
The Enpirion EN5337QI DC-DC converter is  
packaged in a 7 x 4 x 1.85mm 38-pin QFN  
package. The QFN package is constructed  
with copper lead frames that have exposed  
thermal pads. The recommended maximum  
junction temperature for continuous operation  
is 125°C. Continuous operation above 125°C  
will reduce long-term reliability. The device has  
a thermal overload protection circuit designed  
to shut it off at an approximate junction  
temperature value of 150°C.  
The junction temperature, TJ, can also be  
expressed in terms of the device case  
temperature, TC, and the device junction-to-  
case thermal resistance, θJC in °C/W, as  
follows:  
TJ = TC + (PD)(θJC)  
The device case temperature, TC, is the  
temperature at the center of the exposed  
thermal pad at the bottom of the package.  
The device junction-to-ambient and junction-to-  
case thermal resistances, θJA and θJC, are  
shown in the Thermal Characteristics table on  
page 3. The θJC is a function of the device and  
the 38-pin QFN package design. The θJA is a  
function of θJC and the user’s system design  
The silicon is mounted on a copper thermal  
pad that is exposed at the bottom of the  
package. The thermal resistance from the  
silicon to the exposed thermal pad is very low.  
In order to take advantage of this low  
resistance, the exposed thermal pad on the  
package should be soldered directly on to a  
copper ground pad on the printed circuit board  
(PCB). The PCB then acts as a heat sink. In  
order for the PCB to be an effective heat sink,  
the device thermal pad should be coupled to  
copper ground planes or special heat sink  
structures designed into the PCB (refer to the  
recommendations at the end of this note).  
parameters  
that  
include  
the  
thermal  
effectiveness of the customer PCB and airflow.  
The θJA value shown in the Thermal  
Characteristics table on page 3 is for free  
convection with the device heat sunk (through  
the thermal pad) to a copper plated four-layer  
PC board with a full ground and a full power  
plane following JEDEC EIJ/JESD 51  
Standards. The θJA can be reduced with the  
use of forced air convection. Because of the  
The junction temperature, TJ, is calculated from  
the ambient temperature, TA, the device power  
dissipation, PD, and the device junction-to-  
ambient thermal resistance, θJA in °C/W::  
strong  
dependence  
on  
the  
thermal  
effectiveness of the PCB and the system  
design, the actual θJA value will be a function of  
the specific application.  
TJ = TA + (PD)(θJA)  
©Enpirion 2009 all rights reserved, E&OE  
10  
www.enpirion.com  
02638  
6/18/2009  
Rev:D