R
EM6152A
Package Information
Dimensions of 8-pin SOIC Package
E
D
C
0 - 8°
A
A1
B
L
e
H
Dimensions in mm
Min Nom Max
1.35 1.63 1.75
A
A1 0.10 0.15 0.25
4
5
3
2
7
1
8
B
C
D
E
e
0.33 0.41 0.51
0.19 0.20 0.25
4.80 4.94 5.00
3.80 3.94 4.00
1.27
6
H
L
5.80 5.99 6.20
0.40 0.64 1.27
Fig. 14
Dimensions of Exposed Pad SO-16 Package
Dimensions in mm
Min
1.43
0.00
1.43
0.35
0.19
9.80
3.81
Nom
1.55
0.05
1.50
0.41
0.20
9.93
3.94
1.27
5.99
0.64
Max
1.68
0.10
1.58
0.49
0.25
9.98
3.99
A
A1
A2
B
C
D
E
e
H
L
5.84
0.41
6.20
0.89
Exposed pad: 3.56 x 2.29 mm
Fig. 15
Dual Layer PCB
EM6152A Ex. Pad SO16 top layer
EM6152A Ex. Pad SO16 bottom layer
Dimensions in mm
Fig. 16
EM Microelectronic-Marin SA (EM) makes no warranty for the use of its products, other than those expressly contained in the Company's
standard warranty which is detailed in EM's General Terms of Sale located on the Company's web site. EM assumes no responsibility for
any errors which may appear in this document, reserves the right to change devices or specifications detailed herein at any time without
notice, and does not make any commitment to update the information contained herein. No licenses to patents or other intellectual
property of EM are granted in connection with the sale of EM products, expressly or by implications. EM's products are not authorized for
use as components in life support devices or systems.
SUBJECT TO CHANGE WITHOUT NOTICE
Copyright © 2006, EM Microelectronic-Marin SA
06/06, rev. B, Prelim.
12
www.emmicroelectronic.com
EMMICRO [ EM MICROELECTRONIC - MARIN SA ]
