R
EM4150
EM4350
Ordering Information
Die Form
This chart shows general offering; for detailed Part Number to order, please see the table “Standard Versions” below.
EM4150 A6 WS 11 %%%
-
Circuit Nb:
Customer Version:
EM4150: standard pads
EM4350: mega pads
%%% = only for custom specific version
Version:
Bumping:
A6 = Manchester, 64 clocks per bit
A5 = Manchester, 32 clocks per bit
" " (blank) = no bumps
E = with Gold Bumps (Note 2)
Die form:
Thickness:
WW = Wafer
6 = 6 mils (152um)
7 = 7 mils (178um)
11 = 11 mils (280um)
21 = 21 mils (533um)
27 = 27 mils (686um)
WS = Sawn Wafer/Frame
WT = Sticky Tape
WP = Waffle Pack (note 1)
Packaged Devices
This chart shows general offering; for detailed Part Number to order, please see the table “Standard Versions” below.
EM4150 A6 CI2LC %%%
-
Circuit Nb:
Customer Version:
EM4150: standard pads
%%% = only for custom specific version
Version:
A6 = Manchester, 64 clocks per bit
A5 = Manchester, 32 clocks per bit
Package/Card & Delivery Form:
CI2LB = CID Pack, 2 long pins (2.5mm), in tape
CI2LC = CID Pack, 2 long pins (2.5mm), in bulk
CI2SB = CID Pack, 2 short pins (1.25mm), in tape
CI2SC = CID Pack, 2 short pins (1.25mm), in bulk
CB2RC = PCB Package, 2 pins, in bulk
SO8A = SO-8 Package, in stick (note 1)
Remarks:
•
•
For ordering please use table of “Standard Version” table below.
For specifications of Delivery Form, including gold bumps, tape and bulk, as well as possible other delivery form or
packages, please contact EM Microelectronic-Marin S.A.
•
•
Note 1: This is a non-standard package. Please contact EM Microelectronic-Marin S.A for availability.
Note 2: EM4350 is preferably used with gold bumps. Use of EM4150 with gold bump together with direct technology is
subject to license, please contact EM Sales Office.
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