R
EM4223
SOT 23 pinout
Pad A
VDD
EM4223
Pad VSS
Fig. 22
Ordering Information
Packaged Device:
Device in DIE Form:
V% WS 11
V% SP3B
EM4223
EM4223
Version
Version
"Personality word"
Check table below
"Personality word"
Check table below
Package
Die form
SP3B = 3-pin SOT23,
WW = Wafer
in Tape&Reel of 3000 pieces
WS = Sawn Wafer/Frame
Thickness
7 = 7 mils (158um)
11 = 11 mils (280um)
Bumping
" " (blank) = no bump
E = with gold bumps
Versions (Personality word)
Personality
Return link
data rate
160 Kbps
160 Kbps
160 Kbps
160 Kbps
40 Kbps
40 Kbps
40 Kbps
40 Kbps
FST / ISO Flag
Wake Up Status Flag
word
V8
V7
V6
V5
V4
V3
V2
ISO
ISO
FST
FST
ISO
ISO
FST
FST
ISO_MOD
RTF
TTF
ISO_MOD
RTF
TTF
V1
Table 22
Standard Versions:
The versions below are considered standards and should be readily available. For the other delivery form, please contact
EM Microelectronic-Marin S.A. Please make sure to give the complete part number when ordering.
Part Number
Package/Die Form
SOT 23
SOT 23
Die 11 mils
Die 11 mils
Delivery form/Bumping
Tape & reel
Tape & reel
Sawn on frame / Bump
Sawn on frame / Bump
EM4223V2SP3B
EM4223V3SP3B
EM4223V2WS11E
EM4223V3WS11E
Table 23
EM Microelectronic-Marin SA (EM) makes no warranty for the use of its products, other than those expressly contained in the Company's
standard warranty which is detailed in EM's General Terms of Sale located on the Company's web site. EM assumes no responsibility for
any errors which may appear in this document, reserves the right to change devices or specifications detailed herein at any time without
notice, and does not make any commitment to update the information contained herein. No licenses to patents or other intellectual
property of EM are granted in connection with the sale of EM products, expressly or by implications. EM's products are not authorized for
use as components in life support devices or systems.
© EM Microelectronic-Marin SA, 08/05, Rev. C
29
www.emmicroelectronic.com
Copyright © 2005, EM Microelectronic-Marin SA