EM4205-EM4305
Ordering Information – Die form
EM4205 V2 WS 11
%%%
-
Circuit Nb:
Customer Version:
EM4205
%%% = only for custom specific version
Version:
V1=210pF resonant capacitor
V2=250pF resonant capacitor
V4=210pF Trimmed resonant capacitor
V5=250pF Trimmed resonant capacitor
Die form:
Thickness:
WW = Wafer
WS = Sawn Wafer/Frame
6 = 6 mils (152um)
7 = 7 mils (178um)
11 = 11 mils (280um)
27 = 27 mils (686um)
WB = Blister Tape
EM4305 V2 WS 11 E %%%
-
Circuit Nb:
Customer Version:
EM4305
%%% = only for custom specific version
Version:
Bumping:
V1=210pF resonant capacitor
V2=250pF resonant capacitor
V3=330pF resonant capacitor
E = with Gold Bumps
Die form:
Thickness:
WW = Wafer
WS = Sawn Wafer/Frame
WB = Blister Tape
6 = 6 mils (152um)
7 = 7 mils (178um)
11 = 11 mils (280um)
27 = 27 mils (686um)
Figure 17
Remarks:
EM4205: for a sawn or un-sawn wafer delivery, the failed die identification is covered by ink dots applied to the wafer.
EM4305: for a sawn or un-sawn wafer delivery, the failed die identification is covered by electronic wafer mapping. No ink
dots are applied to the wafer.
For specifications of delivery form, including gold bumps, Blister, as well as possible other delivery form or packages,
please contact EM Microelectronic-Marin S.A.
Standard Versions & Samples:
The versions below are considered standards and should be readily available. For other versions or other delivery form,
please contact EM Microelectronic-Marin S.A.
Part Number
Package
Delivery Form
EM4205V2WS11
sawn wafer
sawn wafer
sawn wafer
sawn wafer
Custom
Wafer on frame
Wafer on frame
Wafer on frame
Wafer on frame
Custom
EM4305V1WS11E
EM4305V2WS11E
EM4305V3WS11E
EM4305VXYYY-%%%
Table 18
17
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Copyright 2013, EM Microelectronic-Marin SA
4205-4305-DS-01.doc, Version 4.0, 22-Oct-13
EMMICRO [ EM MICROELECTRONIC - MARIN SA ]
