EM4170
Packages
CID Package
PCB Package
FRONT VIEW
Y
Z
K
J
SYMBOL
MIN
TYP
8.5
MAX
8.8
TOP VIEW
B
A
B
D
e
8.2
3.8
X
4.0
4.2
5.8
6.0
6.2
0.38
1.25
0.3
0.5
0.62
1.35
0.5
F
g
1.3
0.4
MARKING
AREA
D
J
0.42
0.115
0.4
0.44
0.127
0.5
0.46
0.139
0.6
K
R
A
C2
C1
Dimensions are in mm
R
SYMBOL MIN
TYP
MAX
e
X
Y
Z
8.0
4.0
C2
C1
1.0
F
F
Dimensions are in mm
g
Fig. 19
Fig. 20
Ordering Information
Part Number
Bit Coding
Cycle
Bit
Delivery Form /
Bumping
Package / Die Form
EM4170A5WW11
EM4170A5WW11E
EM4170A5WS7
EM4170A5WT11E
EM4170A5CI2LB
EM4170A5CB2RC
Manchester
Manchester
Manchester
Manchester
Manchester
Manchester
32
32
32
32
32
32
unsawn wafer, 11mils thickness
unsawn wafer, 11mils thickness
sawn wafer on frame, 7mils thickness
die on sticky tape, 11mils thickness
CID package, 2 pins (length 2.5mm)
PCB package
No bump
Gold bumps
No bump
Gold bumps
Tape
Bulk
For other packages, please contact EM Sales
Product Support
Check our Web Site under Products/RF Identification section.
Questions can be sent to cid@emmicroelectronic.com
A special development kit exists with embedded co-crypt processor. This tool is mandatory to use authentication
command.
EM Microelectronic-Marin SA cannot assume responsibility for use of any circuitry described other than circuitry entirely embodied in an
EM Microelectronic-Marin SA product. EM Microelectronic-Marin SA reserves the right to change the circuitry and specifications without
notice at any time. You are strongly urged to ensure that the information given has not been superseded by a more up-to-date version.
© EM Microelectronic-Marin SA, 03/02 Rev. B/424
13
www.emmicroelectronic.com
Copyright 2002, EM Microelectronic-Marin SA
EMMICRO [ EM MICROELECTRONIC - MARIN SA ]
