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EM4022 参数 Datasheet PDF下载

EM4022图片预览
型号: EM4022
PDF下载: 下载PDF文件 查看货源
内容描述: 多频非接触式识别设备防碰撞与首旅集团的SuperTag类别协议兼容 [Multi Frequency Contactless Identification Device Anti-Collision compatible with BTG Supertag Category Protocols]
分类和应用:
文件页数/大小: 15 页 / 278 K
品牌: EMMICRO [ EM MICROELECTRONIC - MARIN SA ]
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EM4022
Typical Operating Configurations
Low frequency
inductive transponder .
Medium frequency
applications are those which cannot
use the integrated full wave rectifier and where the
transponder power is transmitted through a coil. External
microwave schottky diodes are required to rectify the
carrier wave. An external power storage capacitor can be
added to improve reading range.
These applications allow higher data rates (64 kbit/s).
Where reading rates of 500 transponders per second
can be achieved
High frequency
RF transponder implementation.
M
Coil1
L
V
DD
CPX
EM4022
Coil2
GAP
D1
Fig. 2
V
SS
M
Coil1
D3
V
DD
CPX
Low frequency applications are those applications that
can make use of the on-chip full wave rectifier bridge to
rectify the incident energy. These are typically
applications that use inductive coupling to transmit
energy to the chip. The carrier frequency is typically less
than 500 kHz. The design of the on-chip rectifier and
resonance capacitor is optimized for frequencies in the
order of 125 kHz. Low frequency transponders can be
implemented using just a EM4022 chip and an external
coil that resonates with the on-chip tuning capacitor at
the required carrier frequency. An external power
storage capacitor is required to maintain the supply
voltage above the integrated power on reset level.
In a very strong field, due to the forward resistance of the
diode, the GAP input must be limited at V
SS
-0.3V by a
schottky diode (D1)
Medium frequency
(13.56 MHz) inductive transponder
implementation
EM4022
D2*
Coil2
GAP
V
SS
D1
Fig. 4
D2 in figure 2 and 3 is optional and is only used for GAP
enable versions. All diodes are schottky type.
High frequency applications are similar to medium
frequency applications. These are typically applications
that use electromagnetic RF coupling to transmit energy
to the chip using carrier frequencies greater than
100 MHz. High frequency transponders can be
implemented using a EM4022 chip, two or three
microwave diodes and a printed antenna. High frequency
RF coupled applications typically have higher reading
distances (> 4 m) and
Bi-frequency
applications are possible by implementing
a coil between coil1 and coil2 connections in the high
frequency application (fig. 4).
M
V
DD
CPX
L
C
D2*
EM4022
GAP
V
SS
D1
Fig. 3
L:
C:
coil antenna (typical value 1.35 µH).
tuning capacitor (typical value 100 pF)
Copyright
2002, EM Microelectronic-Marin SA
2
www.emmicroelectronic.com