R
EM3027
11 Package Information
11.1 TSSOP-08/14
4
B
1.00
1.00
1.00 DIA.
3 2
1
C
B
B
E/2
E
D
C
L
E1
5
e/2
X
X = A AND B
N
0.20 C A-B
2X N/2 TIPS
D
7
4
X
SEE
DETAIL "A"
(14°)
EVEN LEAD SIDES
TOPVIEW
ODD LEAD SIDES
TOPVIEW
A
4
END VIEW
TOP VIEW
bbb
M
C
A-B
D
9
b
0.25
A
0.05
C
2
PARTING
LINE
A
C
H
C
aaa
6
H
L
8
3
e
A
1
SEATING
PLANE
(1.00)
DETAIL 'A'
5
D
(14°)
P1
(VIEW ROTATED 90° C.W.)
S
COMMON
DIMENSIONS
NOM.
NOTE
5
D
NOM.
3.00
5.00
7
Y
M
N
P
N
VARI-
B
O
O
T
ATIONS
MIN.
2.90
4.90
MAX.
3.10
5.10
MIN.
MAX.
1.10
MAX.
1.59
MAX.
E
A L
A
A
3.2
3.0
8
14
1
2
0.05
0.85
0.15
0.95
3.1
0.90
0.076
-
0.22
0.10
-
NOTES:
1. DIE THICKNESS ALLOWABLE IS 0.279±0.0127
2. DIMENSIONING & TOLERANCES PER ASME. Y14.5M-1994.
aaa
b
b1
bbb
c
0.19
0.19
0.30
0.25
9
3. DATUM PLANE H LOCATED AT MOLD PARTING LINE AND COINCIDENT
WITH LEAD, WHERE LEAD EXITS PLASTIC BODY AT BOTTOM OF PARTING LINE.
4. DATUM A-B AND D TO BE DETERMINED WHERE CENTERLINE
BETWEEN LEADS EXITS PLASTIC BODY AT DATUM PLANE H.
0.09
0.09
0.20
0.16
c1
D
E1
e
E
0.127
SEE VARIATIONS
5. "D" & "E1" ARE REFERENCE DATUM AND DO NOT INCLUDE MOLD FLASH OR
PROTRUSIONS, AND ARE MEASURED AT THE BOTTOM PARTING LINE. MOLD
FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15mm ON D AND 0.25mm
ON E PER SIDE.
5
5
4.30
4.40
0.65 BSC
6.40 BSC
0.60
4.50
6. DIMENSION IS THE LENGTH OF TERMINAL FOR SOLDERING TO A SUBSTRATE.
7. TERMINAL POSITIONS ARE SHOWN FOR REFERENCE ONLY.
6
7
0.50
0.70
L
8. FORMED LEADS SHALL BE PLANAR WITH RESPECT TO
ONE ANOTHER WITHIN 0.076mm AT SEATING PLANE.
9. THE LEAD WIDTH DIMENSION DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE
0.07mm TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION
AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE
LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM
SPACE BETWEEN PROTRUSIONS AND AN ADJACENT LEAD SHOULD
BE 0.07mm
N
P
SEE VARIATIONS
SEE VARIATIONS
SEE VARIATIONS
P1
0°
8°
ALL DIMENSIONS IN MILLIMETERS
Copyright © 2009, EM Microelectronic-Marin SA
12/09 – rev D
www.emmicroelectronic.com
26
EMMICRO [ EM MICROELECTRONIC - MARIN SA ]
