EM3027
11.2 SO-8
ADDITION
"X" DIA. EJECTOR PIN.
D/2
SEE NOTE
9
1
3
2
H
+
.010
M
E
M
E/2
O O
C
PARTING LINE
L
5
a
N
DETAIL A
6
TOP VIEW
BOTTOM VIEW
h x 45°
+
.010
M
e
T
E
D
S
B
A
A2
C
NOTES:
3
- T -
1. MAXIMUM DIE THICKNESS ALLOWABLE IS .015.
2. DIMENSIONING & TOLERANCES PER ANSI.Y14.5M - 1982.
3. "T" IS A REFERENCE DATUM.
-E-
4
8
SEATING PLANE
-D-
A1
4
SEE DETAIL A
END VIEW
SIDE VIEW
4. "D" & "E" ARE REFERENCE DATUMS AND DO NOT
INCLUDE MOLD FLASH OR PROTRUSIONS, BUT
S
COMMON
DIMENSIONS
NOM.
Y
M
N
O
T
B
DOES INCLUDE MOLD MISMATCH AND ARE MEASURED
AT THE MOLD PARTING LINE. MOLD FLASH OR
O
L
E
MIN.
1.55
0.127
1.40
0.35
0.19
4.80
3.81
MAX.
A
A
1.63
0.15
1.73
0.25
1.55
0.49
0.25
4.98
3.99
PROTRUSIONS SHALL NOT EXCEED 0.006 INCHES AT END AND
A12
.010 INCHES AT WINDOW
1.47
B
C
D
E
e
0.41
5. "L" IS THE LENGTH OF TERMINAL FOR
SOLDERING TO A SUBSTRATE.
THIS TABLE IN MILLIMETERS
0.20
3
4.93
6. "N" IS THE NUMBER OF TERMINAL POSITIONS.
3.94
7. TERMINAL POSITIONS ARE SHOWN FOR REFERENCE ONLY
1.27 BSC
H
h
5.84
0.25
0.41
5.99
0.33
0.64
8
6.20
0.41
0.89
8. FORMED LEADS SHALL BE PLANAR WITH RESPECT TO
ONE ANOTHER WITHIN .003 INCHES AT SEATING PLANE.
L
5
N
9. THE APPEARANCE OF PIN #1 I.D ON THE 8 LD IS OPTIONAL,
0°
5°
8°
a
ROUND TYPE ON SINGLE LEADFRAME AND RECTANGULAR
2.16
2.36
2.54
X
TYPE ON MATRIX LEADFRAME.
27
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3027-DS.doc, Version 8.0, 25-Jan-13
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