EM78P350N
8-Bit Microprocessor with OTP ROM
C Quality Assurance and Reliability
Test Category
Test Conditions
Remarks
Solder temperature = 255 ± 5°C, for 5 seconds up to the
stopper using a rosin-type flux
Solderability
−
Step 1: TCT, 65°C (15mins) ~ 150°C (15mins), 10 cycles
Step 2: Bake at 125°C, TD (endurance) = 24 hrs
Step 3: Soak at 30°C / 60% , TD (endurance) = 192 hrs
Step 4: IR flow 3 cycles
For SMD IC (such as
SOP, QFP, SOJ, etc)
Pre-condition
(Pkg thickness ≥ 2.5mm or
Pkg volume ≥ 350 mm3 ----235 ± 5°C)
(Pkg thickness ≤ 2.5 mm or
Pkg volume ≤ 350 mm3 ----250 ± 5°C)
Temperature cycle test -65℃(15mins)~150°C (15mins), 200 cycles
−
−
TA =121°C, RH=100%, pressure=2 atm,
Pressure cooker test
TD (endurance)= 96 hrs
High temperature /
TA=85°C , RH=85%，TD (endurance) = 168, 500 hrs
High humidity test
−
−
High-temperature
TA=150°C, TD (endurance) = 500, 1000 hrs
storage life
High-temperature
operating life
TA=125°C, VCC = Max. operating voltage,
TD (endurance) = 168, 500, 1000 hrs
−
−
Latch-up
TA=25°C, VCC = Max. operating voltage, 600 ma / 40V
IP_ND,OP_ND,IO_ND
IP_NS,OP_NS,IO_NS
IP_PD,OP_PD,IO_PD,
IP_PS,OP_PS,IO_PS,
ESD (HBM)
TA=25°C, ≥ ∣ ±4KV∣
ESD (MM)
TA=25°C, ≥ ∣ ±400V∣
VDD-VSS(+),VDD_VSS
(-) mode
C.1 Address Trap Detect
An address trap detect is one of the MCU embedded fail-safe functions that detects
MCU malfunction caused by noise or the like. Whenever the MCU attempts to fetch an
instruction from a certain section of ROM, an internal recovery circuit is auto started. If
a noise caused address error is detected, the MCU will repeat execution of the program
until the noise is eliminated. The MCU will then continue to execute the next program.
104 •
Product Specification (V1.0) 09.14.2006
(This specification is subject to change without further notice)
ELAN [ ELAN MICROELECTRONICS CORP ]
