Contents
APPENDIX
A. Package Type ........................................................................................................91
B
Packaging Configuration...................................................................................... 91
B.1 14-Lead Plastic Dual in line (PDIP) — 300 mil................................................ 91
B.2 14-Lead Plastic Small Outline (SOP) — 150 mil ............................................. 92
B.3 18-Lead Plastic Dual in line (PDIP) — 300 mil................................................ 91
B.4 18-Lead Plastic Small Outline (SOP) — 300 mil ............................................. 92
B.5 20-Lead Plastic Shrink Small Outline (SSOP) — 209 mil................................ 93
B.6 20-Lead Plastic Dual-in-line (PDIP) — 300 mil................................................ 94
B.7 20-Lead Plastic Small Outline (SOPP) — 300 mil........................................... 95
Quality Assurance and Reliability........................................................................ 96
C.1 Address Trap Detect....................................................................................... 96
C
Specification Revision History
Specification Revision History
Doc. Version
1.0
Revision Description
Date
Initial released version
2006/12/01
vi •
Product Specification (V1.0) 12.01.2006
ELAN [ ELAN MICROELECTRONICS CORP ]
