EM78P341N/342N/343N
8-Bit Microprocessor with OTP ROM
C Quality Assurance and Reliability
Test Category
Test Conditions
Remarks
°
Solder temperature=245 ± 5 C, for 5 seconds up to the
Solderability
−
stopper using a rosin-type flux
°
°
Step 1: TCT, 65 C (15mins)~150 C (15mins), 10 cycles
°
Step 2: Bake at 125 C, TD (durance)=24 hrs
°
Step 3: Soak at 30 C /60%，TD (durance)=192 hrs
For SMD IC (such as
SOP, QFP, SOJ, etc)
Pre-condition
Step 4: IR flow 3 cycles
(Pkg thickness ≥ 2.5mm or
3
°
Pkg volume ≥ 350mm ----225 ± 5 C)
(Pkg thickness ≤ 2.5mm or
Pkg volume ≤ 350mm ----240 ± 5 C )
3
°
°
°
Temperature cycle test -65 (15mins)~150 C (15mins), 200 cycles
−
−
°
TA =121 C, RH=100%, pressure=2 atm,
TD (durance) = 96 hrs
Pressure cooker test
High temperature /
High humidity test
°
TA=85 C , RH=85%，TD (durance)=168 , 500 hrs
−
−
High-temperature
storage life
°
TA=150 C, TD (durance)=500, 1000 hrs
°
High-temperature
operating life
TA=125 C, VCC=Max. operating voltage,
−
−
TD (durance) =168, 500, 1000 hrs
°
TA=25 C, VCC=Max. operating voltage, 150mA/20V
Latch-up
IP_ND,OP_ND,IO_ND
IP_NS,OP_NS,IO_NS
IP_PD,OP_PD,IO_PD,
IP_PS,OP_PS,IO_PS,
°
TA=25 C, ≥ ∣ ± 3KV∣
ESD (HBM)
°
TA=25 C, ≥ ∣ ± 300V∣
ESD (MM)
VDD-VSS(+),VDD_VSS
(-)mode
C.1 Address Trap Detect
An address trap detect is one of the MCU embedded fail-safe functions that detects
MCU malfunction caused by noise or the like. Whenever the MCU attempts to fetch an
instruction from a certain section of ROM, an internal recovery circuit is auto started. If
a noise caused address error is detected, the MCU will repeat execution of the program
until the noise is eliminated. The MCU will then continue to execute the next program.
96 •
Product Specification (V1.0) 12.01.2006
(This specification is subject to change without further notice)
ELAN [ ELAN MICROELECTRONICS CORP ]
