EM78P258N
8-Bit Microprocessor with OTP ROM
C Quality Assurance and Reliability
Test category
Solderability
Test conditions
Remarks
Solder temperature=245±5℃, for 5 seconds up to the stopper using
a rosin-type flux
Step 1: TCT, 65℃(15mins)~150℃(15mins), 10 cycles
Step 2: Bake at 125℃, TD (endurance)=24 hrs
Step 3: Soak at 30°C/60%，TD (endurance)=192 hrs
Step 4: IR flow 3 cycles
For SMD IC (such as
SOP, QFP, SOJ, etc)
Pre-condition
(Pkg thickness≧2.5mm or
Pkg volume≧350mm3 ----225±5℃)
(Pkg thickness≦2.5mm or
Pkg volume≦350mm3 ----240±5℃)
Temperature cycle test -65℃(15mins)~150℃(15mins), 200 cycles
TA =121℃, RH=100%, pressure=2 atm,
Pressure cooker test
TD (endurance)= 96 hrs
High temperature /
TA=85℃, RH=85%，TD (endurance)=168 , 500 hrs
High humidity test
High-temperature
TA=150℃, TD (endurance)=500, 1000 hrs
storage life
High-temperature
operating life
TA=125℃, VCC=Max. operating voltage,
TD (endurance) =168, 500, 1000 hrs
Latch-up
TA=25℃, VCC=Max. operating voltage, 150mA/20V
IP_ND,OP_ND,IO_ND
IP_NS,OP_NS,IO_NS
IP_PD,OP_PD,IO_PD,
IP_PS,OP_PS,IO_PS,
ESD (HBM)
TA=25℃, ≧∣ ±3KV∣
ESD (MM)
TA=25℃, ≧∣ ±300V∣
VDD-VSS(+),VDD_VSS
(-)mode
C.1 Address Trap Detect
An address trap detect is one of the MCU embedded fail-safe functions that detects
MCU malfunction caused by noise or the like. Whenever the MCU attempts to fetch an
instruction from a certain section of ROM, an internal recovery circuit is auto started. If
a noise caused address error is detected, the MCU will repeat execution of the program
until the noise is eliminated. The MCU will then continue to execute the next program.
74 •
Product Specification (V1.0) 06.16.2005
(This specification is subject to change without further notice)
ELAN [ ELAN MICROELECTRONICS CORP ]
