EM65571
130COM/128SEG 65K Color STN LCD Driver
3.2 Pin Dimensions
Size
Item
Pad No.
Unit
X
20580
30
Y
1720
70
Chip size
-
1~28,272~299,333~766
300~332,767~799
30~270
70
30
Bump Size
42
59
29,271
48
70
Pad Pitch
45 (min.)
µm
Die thickness
20+-1 mil (500+-25 µm)
(excluding bumps)
Bump Height
Minimum Bump Gap
Coordinate Origin
17+-3 µm
15
Chip center
Recommended Cog Ito Traces Resistor
Interface
ITO Traces Resistances
V0~V4
CAP1+, CAP1-, CAP2+, CAP2-, CAP3+,
CAP4+, CAP5+, CAP6+, Vout
VDD, VEE
Max = 50Ω
VSSL, VSSH
WRB, RDB, CSB,… D0~D7
RESB
Max = 3KΩ
Max = 5~10KΩ
Product Specification (V1.0) 08.04.2005
• 3
(This specification is subject to change without further notice)
ELAN [ ELAN MICROELECTRONICS CORP ]
