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EBJ20UF8BDU0-DJ-F 参数 Datasheet PDF下载

EBJ20UF8BDU0-DJ-F图片预览
型号: EBJ20UF8BDU0-DJ-F
PDF下载: 下载PDF文件 查看货源
内容描述: [DDR DRAM Module, 256MX64, CMOS, HALOGEN FREE AND ROHS COMPLIANT, SODIMM-204]
分类和应用: 动态存储器双倍数据速率内存集成电路
文件页数/大小: 16 页 / 140 K
品牌: ELPIDA [ ELPIDA MEMORY ]
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EBJ20UF8BDU0  
Serial PD Matrix  
-DJ  
-GN  
Byte  
No.  
Function described  
Hex Comments  
Hex Comments  
Number of serial PD bytes written/SPD device  
size/CRC coverage  
0
92h 176/256/0-116  
92h 176/256/0-116  
1
SPD revision  
10h Rev.1.0  
10h Rev.1.0  
2
Key byte/DRAM device type  
Key byte/module type  
0Bh DDR3 SDRAM  
03h SO-DIMM  
03h 2G bits, 8 banks  
19h 15 rows, 10 columns  
00h 1.5V  
0Bh DDR3 SDRAM  
03h SO-DIMM  
03h 2G bits, 8 banks  
19h 15 rows, 10 columns  
00h 1.5V  
3
4
SDRAM density and banks  
SDRAM addressing  
5
6
Module nominal voltage, VDD  
Module organization  
7
01h 1 rank/×8 bits  
03h 64 bits/non-ECC  
52h 5/2  
01h 1 rank/×8 bits  
03h 64 bits/non-ECC  
52h 5/2  
8
Module memory bus width  
9
Fine timebase (FTB) dividend/divisor  
Medium timebase (MTB) dividend  
Medium timebase (MTB) divisor  
SDRAM minimum cycle time (tCK (min.))  
Reserved  
10  
11  
12  
13  
14  
15  
16  
17  
01h 1  
01h 1  
08h 8  
08h 8  
0Ch1.5ns  
0Ah 1.25ns  
00h —  
00h —  
SDRAM CAS latencies supported, LSB  
SDRAM CAS latencies supported, MSB  
SDRAM minimum CAS latencies time (tAA (min.))  
7Eh 5, 6, 7, 8, 9, 10  
00h —  
FEh5, 6, 7, 8, 9, 10, 11  
00h —  
69h 13.125ns  
69h 13.125ns  
78h 15ns  
SDRAM minimum write recovery time (tWR (min.)) 78h 15ns  
SDRAM minimum /RAS to /CAS delay  
18  
19  
69h 13.125ns  
69h 13.125ns  
30h 6ns  
(tRCD (min.))  
SDRAM minimum row active to row active delay  
(tRRD (min.))  
30h 6ns  
20  
21  
SDRAM minimum row precharge time (tRP (min.))  
SDRAM upper nibbles for tRAS and tRC  
69h 13.125ns  
11h —  
69h 13.125ns  
11h —  
SDRAM minimum active to precharge time  
(tRAS (min.)), LSB  
22  
23  
24  
25  
26  
20h 36ns  
18h 35ns  
SDRAM minimum active to active /auto-refresh time  
(tRC (min.)), LSB  
89h 49.125ns  
00h 160ns  
05h 160ns  
3Ch7.5ns  
81h 48.125ns  
00h 160ns  
05h 160ns  
3Ch7.5ns  
SDRAM minimum refresh recovery time delay  
(tRFC (min.)), LSB  
SDRAM minimum refresh recovery time delay  
(tRFC (min.)), MSB  
SDRAM minimum internal write to read  
command delay (tWTR (min.))  
SDRAM minimum internal read to precharge  
command delay (tRTP (min.))  
27  
28  
29  
30  
31  
3Ch7.5ns  
3Ch7.5ns  
Upper nibble for tFAW  
00h 30ns  
00h 30ns  
Minimum four activate window delay time  
(tFAW (min.))  
F0h 30ns  
F0h 30ns  
SDRAM optional features  
83h DLL-off, RZQ/6, 7  
83h DLL-off, RZQ/6, 7  
PASR/2X refresh at +85ºC to  
+95ºC  
PASR/2X refresh at +85ºC to  
+95ºC  
SDRAM thermal and refresh options  
81h  
81h  
32  
33  
Module thermal sensor  
SDRAM device type  
00h Not incorporated  
00h Standard  
00h Not incorporated  
00h Standard  
Data Sheet E1795E20 (Ver. 2.0)  
5