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EBE10AD4AGFA 参数 Datasheet PDF下载

EBE10AD4AGFA图片预览
型号: EBE10AD4AGFA
PDF下载: 下载PDF文件 查看货源
内容描述: 注册1GB DDR2 SDRAM DIMM [1GB Registered DDR2 SDRAM DIMM]
分类和应用: 动态存储器双倍数据速率
文件页数/大小: 23 页 / 199 K
品牌: ELPIDA [ ELPIDA MEMORY ]
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EBE10AD4AGFA  
-6E  
667  
-5C  
-4A  
Frequency (Mbps)  
Parameter  
533  
400  
Symbol min.  
max.  
min.  
max.  
min.  
max.  
Unit  
ns  
Notes  
Active to precharge command tRAS  
Active to auto-precharge delay tRAP  
45  
70000  
45  
70000  
40  
70000  
tRCD min.  
tRCD min.  
tRCD min.  
ns  
Active bank A to active bank B  
tRRD  
7.5  
7.5  
7.5  
ns  
command period  
Write recovery time  
tWR  
15  
15  
15  
ns  
Auto precharge write recovery +  
precharge time  
(tWR/tCK)+  
(tRP/tCK)  
(tWR/tCK)+  
(tRP/tCK)  
(tWR/tCK)+  
(tRP/tCK)  
tDAL  
tCK  
1
Internal write to read command  
delay  
tWTR  
tRTP  
7.5  
7.5  
7.5  
10  
ns  
Internal read to precharge  
command delay  
7.5  
7.5  
ns  
Exit self refresh to a non-read  
command  
tXSNR tRFC + 10  
tXSRD 200  
tRFC + 10  
tRFC + 10  
ns  
Exit self refresh to a read  
command  
200  
2
200  
2
tCK  
tCK  
tCK  
Exit precharge power down to  
any non-read command  
tXP  
2
2
Exit active power down to read  
command  
tXARD  
2
2
3
Exit active power down to read  
command  
tXARDS 7AL  
6 AL  
6 AL  
tCK  
2, 3  
(slow exit/low power mode)  
CKE minimum pulse width (high  
and low pulse width)  
tCKE  
tOIT  
3
3
3
tCK  
ns  
Output impedance test driver  
delay  
0
12  
0
12  
0
12  
Auto refresh to active/auto  
refresh command time  
tRFC  
105  
105  
105  
ns  
Average periodic refresh interval  
(0°C TC +85°C)  
tREFI  
tREFI  
7.8  
3.9  
7.8  
3.9  
7.8  
3.9  
µs  
µs  
(+85°C < TC +95°C)  
Minimum time clocks remains  
ON after CKE asynchronously tDELAY  
drops low  
tIS + tCK +  
tIH  
tIS + tCK +  
tIH  
tIS + tCK +  
tIH  
ns  
Notes: 1. For each of the terms above, if not already an integer, round to the next higher integer.  
2. AL: Additive Latency.  
3. MRS A12 bit defines which active power down exit timing to be applied.  
4. The figures of Input Waveform Timing 1 and 2 are referenced from the input signal crossing at the  
VIH(AC) level for a rising signal and VIL(AC) for a falling signal applied to the device under test.  
5. The figures of Input Waveform Timing 1 and 2 are referenced from the input signal crossing at the  
VIH(DC) level for a rising signal and VIL(DC) for a falling signal applied to the device under test.  
CK  
DQS  
/CK  
/DQS  
tIS  
tIH  
tIS  
tIH  
tDS tDH  
tDS tDH  
VDDQ  
VDDQ  
VIH (AC)(min.)  
VIH (DC)(min.)  
VREF  
VIH (AC)(min.)  
VIH (DC)(min.)  
VREF  
VIL (DC)(max.)  
VIL (AC)(max.)  
VSS  
VIL (DC)(max.)  
VIL (AC)(max.)  
VSS  
Input Waveform Timing 1 (tDS, tDH)  
Input Waveform Timing 2 (tIS, tIH)  
Preliminary Data Sheet E0865E11 (Ver. 1.1)  
17  
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