EL2130C
85 MHz Current Feedback Amplifier
Typical Performance Curves Ð Contd.
8-Lead Plastic DIP
Maximum Power Dissipation
vs Ambient Temperature
Bandwidth and Peaking
a
Bandwidth and Peaking
e
e a
2
V
vs R for A
F
1
vs R for A
F
V
8-Lead SO
Maximum Power Dissipation
vs Ambient Temperature
Rise Time and Overshoot
e
Rise Time and Overshoot
e
vs R for A
F
1
vs R for A
V
2
V
F
2130–10
Use of sockets, particularly for the SO package,
should be avoided if possible. Sockets add para-
sitic inductance and capacitance which will result
in peaking and overshoot.
Applications Information
Power Supply Bypassing
The EL2130 will exhibit ringing or oscillation if
the power supply leads are not adequately by-
passed. 0.1 mF ceramic disc capacitors are sug-
gested for both supply pins at a distance no
greater than (/2 inch from the device. Surface
mounting chip capacitors are strongly recom-
mended.
Video Characteristics and Applications
Frequency domain testing is performed at Elan-
tec using a computer controlled HP model 8656B
Signal Generator and an HP Model 4195A Net-
work/Spectrum Analyzer. The DUT test board is
built using microwave/strip line techniques, and
solid coaxial cables route the stimulus to the
DUT socket. Signals are routed to and from the
DUT test fixture using subminiature coaxial ca-
ble.
Lead Dress
A ground plane to which decoupling capacitors
and gain setting resistors are terminated will
eliminate overshoot and ringing. However, the
ground plane should not extend to the vicinity of
both the non-inverting and inverting inputs (pins
3 and 2) which would add capacitance to these
nodes, and lead lengths from these pins should be
made as short as possible.
Differential Gain and Phase are tested at a noise
gain of 2 with 100X load. Gain and Phase mea-
surements are made with a DC input reference
7
ELANTEC [ ELANTEC SEMICONDUCTOR ]
