SMB-ULD-Q1 参数 Datasheet PDF下载

DOMINANT

TM

Semiconductors

Innovating Illumination

InGaN M-Spice : SMx-ULD

Recommended Solder Pad

Note: Component is based on a new package platform, which features “Bottom Only Terminations“. Solder joints are only formed

at the bottom of the component and solder fillet will not be observable as the sides of the component.

6

23/02/2006 V1.0