ABS1 THRU ABS10
MINI SILICON SURFACE MOUNT BRIDGE RECTIFIER
Reverse Voltage - 100 to 1000 Volts
Forward Current - 1.0 Ampere
FEATURES
Ideal for printed circuit board
●
Reliable low cost construction technique
results in inexpensive product
●
High temperature soldering guaranteed :
260
°C
/ 10 seconds / 0.375” ( 9.5mm )
lead length at 5 lbs., ( 2.3 kg ) tension
●
0.136(3.45)
0.128(3.25)
0.161(4.1)
0.154(3.9)
ABS
0.177(4.5)
0.169(4.3)
0.252(6.4)
0.236(6.0)
0.010(0.25)
0.006(0.15)
0.002(0.05)
0.006(0.15)
0.028(0.7)
0.024(0.6)
0.028(0.7)
0.012(0.3)
0.006(0.15)
0.002(0.05)
MECHANICAL DATA
Case : Molded Plastic
●
Epoxy : Device has UL flammability classification 94V-0
●
Mounting Position : Any
●
Marking : Type Number
●
0.059(1.50) MAX.
DETAIL "A", SCALE=20/1
0.056(1.42)
0.048(1.22)
0.20(5.1)
0.193(4.9)
A
0.033(0.85)
0.026(0.65)
0~10
O
1
2
3
4
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25 C ambient temperature unless otherwise specified.
Single phase half-wave 60Hz,resistive or inductive load,for capacitive load current derate by 20%.
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Rectified Output Current
-On glass-epoxy P.C.B.
-On aluminum substrate
Non-Repetitive Peak Forward Surge Current 8.3ms
Single half sine-wave superimposed on rated load
(JEDEC Method)
I
2
t Rating for Fusing (t < 8.3ms)
Forward Voltage per element
Peak Reverse Current
At Rated DC Blocking Voltage
@I
F
= 0.4A
@T
A
= 25°C
@T
A
= 125°C
Symbol
V
RRM
V
RWM
V
R
V
R(RMS)
I
O
ABS1
ABS2
ABS4
ABS6
ABS8
ABS10
Unit
100
70
200
140
400
280
0.8
1.0
30
10
0.95
10
150
25
62.5
25
600
420
800
560
1000
700
V
V
A
I
FSM
I
2
t
V
FM
I
RM
C
j
R
R
JA
JL
A
A
2
s
V
µA
pF
°C/W
°C
Typical Junction Capacitance per leg (Note 2)
Typical Thermal Resistance per leg (Note 1)
Operating and Storage Temperature Range
T
j
, T
STG
-55 to +150
Note: 1. On aluminum suvstrate P.C.B. with an area of 0.8×0.8”(20×20mm) mounted on 0.05×0.05”(1.3×1.3mm) solder pad.
2. On glass epoxy P.C.B. mouted on 0.05×0.05”(1.3×1.3mm) pads.
DIOTECH [ DIOTECH COMPANY. ]
