ZXSC400
PACKAGE OUTLINE
PAD LAYOUT DETAILS
b
e
2
L
E1
E
DATUM A
a
e1
D
A
A2
A1
CONTROLLING DIMENSIONS IN MILLIMETRES APPROX CONVERSIONS INCHES.
PACKAGE DIMENSIONS
Millim e tre s
In ch e s
Min
Millim e tre s
In ch e s
Min
DIM
DIM
Min
0.90
0.00
0.90
0.35
0.09
2.80
Ma x
1.45
0.15
1.30
0.50
0.20
3.00
Ma x
0.057
0.006
0.051
0.019
Min
2.60
1.50
0.10
Ma x
3.00
1.75
0.60
Ma x
0.118
0.069
0.002
A
A1
A2
b
0.35
0
E
E1
L
0.102
0.059
0.004
0.035
0.014
e
0.95 REF
1.90 REF
0° 10°
0.037 REF
0.074 REF
0° 10°
C
0.0035 0.008
0.110 0.118
e 1
L
D
© Zetex plc 2003
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ISSUE 1 - J ANUARY 2003
16
DIODES [ DIODES INCORPORATED ]
