U-DFN2626-10
X2
Y
Dimensions
X1
Y2
Y1
C
X
X1
X2
Y
Y1
Y2
Value
(in mm)
0.500
0.300
2.250
2.300
0.600
1.360
3.000
Pin1
C
X
U-DFN3016-12
X1
Y
(12x)
Dimensions
C
X
X1
X2
Y
Y1
Y2
X2
Y1
Y2
Value
(in mm)
0.500
0.300
2.800
2.250
0.600
0.450
2.050
C
X
(12x)
W-DFN3020-8
Type B
C
X
Y1
G
Y2
Y
G1
X1
Dimensions Value (in mm)
C
0.650
G
0.285
G1
0.090
X
0.400
X1
1.120
Y
0.730
Y1
0.500
Y2
0.365
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 52
7 of 27
Suggested Pad Layout
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