DFLU1200
1.0A SURFACE MOUNT SUPER-FAST RECTIFIER
PowerDI
ä
123
Features
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Glass Passivated Die Construction
Super-Fast Recovery Time for High Efficiency
Low Forward Voltage Drop and High Current Capability
Lead Free Finish, RoHS Compliant (Note 2)
Green Molding Compound (No Br, Sb)
Qualified to AEC-Q101 Standards for High Reliability
A
NEW PRODUCT
PowerDI
ä
123
Dim
D
H
Min
3.50
2.60
1.63
0.93
0.85
0.15
0.45
—
—
—
0.90
Max
3.90
3.00
1.93
1.00
1.25
0.25
0.85
—
—
—
1.30
Typ
3.70
2.80
1.78
0.98
1.00
0.20
0.65
1.35
1.10
0.20
1.05
A
B
C
D
E
Mechanical Data
Case: PowerDI
ä
123
Case Material: Molded Plastic, "Green" Molding
Compound. UL Flammability Classification Rating
94V-0
Moisture sensitivity: Level 1 per J-STD-020C
Terminal Connections: Cathode Band
Terminals: Finish – Matte Tin annealed over Copper
leadframe. Solderable per MIL-STD-202,
Method 208
e
3
Marking & Type Code Information: See Last Page
Ordering Information: See Last Page
Weight: 0.01 grams (approximate)
E
L4
A
L2
L3
C
B
E
H
L
L1
L2
L3
L4
L
L1
L
All Dimensions in mm
Maximum Ratings and Electrical Characteristics
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Rectified Output Current
Non-Repetitive Peak Forward Surge Current
8.3ms Single half sine-wave Superimposed on Rated Load
Forward Voltage Drop (Note 5)
Peak Reverse Current
at Rated DC Blocking Voltage (Note 5)
Reverse Recovery Time (Note 4)
Typical Total Capacitance (f = 1MHz, V
R
= 4VDC)
Operating and Storage Temperature Range
@ I
F
= 0.6A
@ I
F
= 1.0A
@ T
A
= 25°C
@ T
A
= 100°C
Symbol
V
RRM
V
RWM
V
R
V
R(RMS)
I
O
I
FSM
V
FM
I
RM
t
rr
C
T
T
j,
T
STG
T
A
= 25°C unless otherwise specified
DFLU1200
200
140
1.0
30
0.90
0.98
5.0
200
25
27
-65 to +150
Unit
V
V
A
A
V
mA
ns
pF
°C
Thermal Characteristics
Characteristic
Power Dissipation (Note 1)
@ T
A
= 25°C unless otherwise specified
Symbol
P
D
R
qJA
R
qJS
Typ
¾
116
¾
Max
1.0
¾
6
Unit
W
°C/W
°C/W
Thermal Resistance Junction to Ambient (Note 1)
Thermal Resistance Junction to Soldering (Note 3)
Notes:
1.
2.
3.
4.
5.
Device mounted on 1" x 1", Polymide PCB; 2 oz. Cu pad layout as shown on Diodes Inc. suggested pad layout document AP02001.pdf.
RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see
Theoretical R
qJS
calculated from the top center of the die straight down to the PCB cathode tab solder junction.
Measured with I
F
= 0.5A, I
R
= 1.0A, I
rr
= 0.25A. See figure 5.
Short duration pulse test to minimize self-heating effect.
DS30601 Rev. 2 - 2
PowerDI is a trademark of Diodes Incorporated.
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DFLU1200
ã
Diodes Incorporated
DIODES [ DIODES INCORPORATED ]
