BC847BS
DUAL NPN SMALL SIGNAL SURFACE MOUNT TRANSISTOR
Features
•
•
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Ideally Suited for Automated Insertion
For Switching and AF Amplifier Applications
Ultra-Small Surface Mount Package
Lead Free/RoHS Compliant (Note 2)
Qualified to AEC-Q101 Standards for High Reliability
"Green" Device (Note 4 and 5)
A
SOT-363
Dim
A
B C
Min
0.10
1.15
2.00
0.30
1.80
—
0.90
0.25
0.10
0°
Max
0.30
1.35
2.20
0.40
2.20
0.10
1.00
0.40
0.25
8°
B
C
D
Mechanical Data
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Case: SOT-363
Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020C
Terminals: Solderable per MIL-STD-202, Method 208
Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe).
Terminal Connections: See Diagram
Marking Information: K1F, See Page 2
Ordering & Date Code Information: See Page 2
Weight: 0.006 grams
K
0.65 Nominal
H
M
F
H
J
K
D
F
L
J
C
2
B
1
L
M
α
E
1
All Dimensions in mm
E
2
B
2
C
1
Maximum Ratings
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current
Peak Collector Current
Peak Base Current
Power Dissipation
@T
A
= 25°C unless otherwise specified
Symbol
V
CBO
V
CEO
V
EBO
I
C
I
CM
I
BM
(Note 1)
(Note 1)
P
d
R
θ
JA
T
j
, T
STG
Value
50
45
5.0
100
200
200
200
500
-65 to +150
Unit
V
V
V
mA
mA
mA
mW
°C/W
°C
Characteristic
Thermal Resistance, Junction to Ambient
Operating and Storage Temperature Range
Electrical Characteristics
Characteristic
DC Current Gain
Collector-Emitter Saturation Voltage
Base-Emitter Saturation Voltage
Base-Emitter Voltage
Collector Cutoff Current
Emitter Cutoff Current
Gain Bandwidth Product
Collector-Base Capacitance
Emitter-Base Capacitance
Notes:
@T
A
= 25°C unless otherwise specified
Symbol
(Note 3)
(Note 3)
(Note 3)
(Note 3)
(Note 3)
(Note 3)
h
FE
V
CE(SAT)
V
BE(SAT)
V
BE
I
CBO
I
CBO
I
EBO
f
T
C
CBO
C
EBO
Min
200
—
—
580
—
—
100
—
—
Typ
—
—
—
755
665
—
—
—
—
2.0
11
Max
450
100
400
—
700
15
5.0
100
—
3.0
—
Unit
—
mV
mV
mV
nA
µA
nA
MHz
pF
pF
Test Condition
V
CE
= 5.0V, I
C
= 2.0mA
I
C
= 10mA, I
B
= 0.5mA
I
C
= 100mA, I
B
= 5.0mA
I
C
= 10mA, I
B
= 0.5mA
V
CE
= 5.0V, I
C
= 2.0mA
V
CB
= 30V, I
E
= 0
V
CB
= 30V, T
j
= 125°C
V
EB
= 5.0V, I
C
= 0
V
CE
= 5.0V, I
C
= 10mA,
f = 100MHz
V
CB
= 10V, f = 1.0MHz
V
EB
= 0.5V, f = 1.0MHz
1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which can be found
on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. No purposefully added lead.
3. Short duration pulse test used to minimize self-heating effect.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
DS30222 Rev. 12 - 2
1 of 3
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BC847BS
© Diodes Incorporated
DIODES [ DIODES INCORPORATED ]
