BC847BVN-7 参数 Datasheet PDF下载

Lead-free Green

BC847BVN

COMPLEMENTARY PAIR SMALL SIGNAL SURFACE

MOUNT TRANSISTOR

Features

•

•

•

•

•

•

•

•

•

•

•

•

•

Epitaxial Die Construction

Two internally isolated NPN/PNP Transistors in one

package

Ultra-Small Surface Mount Package

Lead Free By Design/RoHS Compliant (Note 2)

"Green" Device (Note 3)

E

1

B

1

C

2

A

C

1

B

2

E

2

SOT-563

B C

KAW YM

D

G

Dim

A

B

C

D

G

Min

0.15

1.10

1.55

0.90

1.50

0.56

0.10

0.10

Max

0.30

1.25

1.70

0.50

1.10

1.70

0.60

0.30

0.18

Typ

0.25

1.20

1.60

1.00

1.60

0.60

0.20



Mechanical Data

Case: SOT-563

Case Material: Molded Plastic, “Green” Molding

Compound. UL Flammability Classification Rating 94V-0

Moisture Sensitivity: Level 1 per J-STD-020C

Terminals: Finish



Matte Tin Finish annealed over Copper

leadframe. Solderable per MIL-STD-202, Method 208

Terminal Connections: See Diagram

Marking (See Page 3): KAW

Ordering & Date Code Information: See Page 4

Weight: 0.003 grams (approximate)

Q

1

C

1

B

2

K

H

M

H

K

L

L

M

E

2

All Dimensions in mm

Q

2

E

1

B

1

C

2

Maximum Ratings

Collector-Base Voltage

Collector-Emitter Voltage

Emitter-Base Voltage

Collector Current

Peak Collector Current

Peak Emitter Current

@ T

A

= 25°C unless otherwise specified

NPN, BC847B Type (Q

1

)

Value

50

45

6.0

100

200

200

Unit

V

V

V

mA

mA

mA

V

CBO

V

CEO

V

EBO

I

C

I

CM

I

EM

Characteristic

Symbol

Maximum Ratings

Collector-Base Voltage

Collector-Emitter Voltage

Emitter-Base Voltage

Collector Current

Peak Collector Current

Peak Emitter Current

@ T

A

= 25°C unless otherwise specified

PNP, BC857B Type (Q

2

)

Symbol

V

CBO

V

CEO

V

EBO

I

C

I

CM

I

EM

Value

-50

-45

-5.0

-100

-200

-200

Unit

V

V

V

mA

mA

mA

Characteristic

Thermal Characteristics

Characteristic

Power Dissipation (Note 1) @T

A

= 25

o

C

Operating and Storage Temperature Range

Notes:

Symbol

Total Device

P

d

R

θJA

T

j

, T

STG

Value

150

833

-65 to +150

Unit

mW

°C/W

°C

Thermal Resistance, Junction to Ambient (Note 1) @T

A

= 25

o

C

1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout

document AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.

2. No purposefully added lead.

3. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.

DS30627 Rev. 4 - 2

1 of 4

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BC847BVN

©

Diodes Incorporated