BAT54 /A /C /S
SURFACE MOUNT SCHOTTKY BARRIER DIODE
Features
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Low Turn-on Voltage
Fast Switching
PN Junction Guard Ring for Transient and ESD Protection
Lead Free/RoHS Compliant (Note 3)
“Green” Molding Compound (No Br, Sb) (Note 4)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
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Case: SOT-23
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Matte Tin Finish annealed over Alloy 42 leadframe
(Lead Free Plating). Solderable per MIL-STD-202, Method 208
Polarity: See Diagrams Below
Marking Information: See Page 3
Ordering Information: See Page 2
Weight: 0.008 grams (approximate)
Top View
BAT54
BAT54A
BAT54C
BAT54S
Maximum Ratings
@T
A
= 25°C unless otherwise specified
Symbol
V
RRM
V
RWM
V
R
I
F
I
FRM
I
FSM
Value
30
200
300
600
Unit
V
mA
mA
mA
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Forward Continuous Current (Note 2)
Repetitive Peak Forward Current
Forward Surge Current
@ t < 1.0s
Thermal Characteristics
Characteristic
Power Dissipation (Note 2)
Thermal Resistance, Junction to Ambient Air (Note 2)
Operating and Storage Temperature Range (Note 5)
Symbol
P
D
R
θ
JA
T
J
, T
STG
Value
200
500
-65 to +150
Unit
mW
°C/W
°C
Electrical Characteristics
Characteristic
Reverse Breakdown Voltage (Note 1)
@T
A
= 25°C unless otherwise specified
Symbol
V
(BR)R
Min
30
Typ
⎯
Max
⎯
240
320
400
500
800
2.0
10
5.0
Unit
V
Test Condition
I
RS
= 100μA
I
F
= 0.1mA
I
F
= 1mA
I
F
= 10mA
I
F
= 30mA
I
F
= 100mA
V
R
= 25V
V
R
= 1.0V, f = 1.0MHz
I
F
= 10mA through I
R
= 10mA to
I
R
= 1.0mA, R
L
= 100Ω
Forward Voltage
V
F
I
R
C
T
t
rr
⎯
⎯
mV
Reverse Leakage Current (Note 1)
Total Capacitance
Reverse Recovery Time
Notes:
1.
2.
3.
4.
⎯
⎯
⎯
⎯
⎯
⎯
μA
pF
ns
Short duration test pulse used to minimize self-heating effect.
Part mounted on FR-4 board with recommended pad layout, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
No purposefully added lead.
Products manufactured with date code VD (Week 50, 2008) and newer are built with Green Molding Compound. Products manufactured with date code
prior to VD are built with Non-Green Molding Compound and may contain Halogens or Sb
2
O
3
Fire Retardants.
5. The heat generated must be less than the thermal conductivity from Junction-to-Ambient: dP
D
/dT
J
< 1/R
θJA
BAT54 /A /C /S
Document number: DS11005 Rev. 25 - 2
1 of 4
June 2010
© Diodes Incorporated
DIODES [ DIODES INCORPORATED ]
