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MAXIMUM RATINGS & ELECTRICAL CHARACTERISTICS
LOW THERMAL STRESS STRUCTURE - PASS
5 CYCLE (-55 C TO +150 C) THERMAL SHOCK TEST
DIOTEC ELECTRONICS CORP
2#¢1 ¢¤©§¨0)&"! ¢¤¨¦ ¥ £¤¢
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S R
I H F
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@ 9 76 4
i w v u s r i gf d b ` X Y W
cg E¨t 0¤q pEch¤e 0ca¢XV
PROPRIETARY HIGH TEMPERATURE JUNCTION
PASSIVATION FOR SUPERIOR RELIABILITY AND
PERFORMANCE
PRESS FIT INTO HEAT SINK TO FURTHER ENHANCE
HEAT HANDLING CAPABILITY
VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM
MECHANICAL STRENGTH AND HEAT DISSIPATION
(Solder Voids: Typical < 2%, Max. < 5% of Die Area)
MECHANICAL DATA
FEATURES
50 AMP PRESS FIT HIGH VOLTAGE DIODES
0.505
”
/502
”
OVER KNURL
0.007”
0.005”
DT
B5004A
0452
70 Typ.
MECHANICAL SPECIFICATION
78 Places
Equally
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0.052
”
+
0.002”
ALL DIMENSIONS IN INCHES
oHS
R
0.173”
0.157”
0.194”
0.184”
Data Sheet No. B50PF-1A
SQUARE DIE
0.180”
T
IAN
L
MP
CO
0.401”
0.385”
0.039”
0.031”
1.02”
0.98”
o
o
DEC [ DIOTEC ELECTRONICS CORPORATION ]
