Surface Mount PTC FSMD Series
Pad Layouts Solder Reflow and Rework Recommendations
FUZETEC
The dimension in the table below provide the recommended pad layout for each FSMD device
Pad dimensions(millimeters)
Device
FSMD014
FSMD020
FSMD035
FSMD050
FSMD075
FSMD110
FSMD160
A
Nominal
3.45
3.45
3.45
3.45
3.45
3.45
3.45
B
Nominal
1.78
1.78
1.78
1.78
1.78
1.78
1.78
C
Nominal
3.15
3.15
3.15
3.15
3.15
3.15
3.15
Solder reflow
1
Recommended reflow methods; IR , vapor phase
oven, hot air oven.
2 The FSMD014 FSMD020 FSMD035
FSMD050 FSMD075 FSMD110 and FSMD160
devices are suitable for use with wave-solder
application methods.
3 Recommended maximum paste thickness is
0.25mm.
4 Devices can be cleaned using standard industry
methods and solvents.
CAUTION:
If reflow temperatures exceed the recommended
Profile, devices may not meet the performance
requirements.
Rework:
Use standard industry practices.
4
DB LECTRO Inc., 3600-I, boulevard Matte, Brossard, QC J4Y 2Z2
DBLECTRO [ DB LECTRO INC ]
