Spec. No. : C355S3
Issued Date : 2002.06.01
Revised Date : 2016.07.18
Page No. : 6/6
CYStech Electronics Corp.
SOT-323 Dimension
3
Marking:
A
Q
C
A1
Device Code
Date Code
8D
TE
Lp
1
2
detail Z
bp
e1
W
B
e
A
E
Z
D
3-Lead SOT-323 Plastic
Surface Mounted Package
CYStek Package Code: S3
θ
v
A
He
mm
2
0
1
Style: Pin 1.Base 2.Emitter 3.Collector
scale
*: Typical
Inches
Min. Max.
Millimeters
Inches
Min. Max.
Millimeters
DIM
DIM
Min.
0.80
0.00
0.20
0.08
1.80
1.15
1.20
Max.
1.10
0.10
0.40
0.15
2.20
1.35
1.40
Min.
Max.
A
A1
bp
C
D
E
0.0315 0.0433
0.0000 0.0039
0.0078 0.0157
0.0031 0.0059
0.0709 0.0866
0.0453 0.0531
0.0472 0.0551
e1
He
Lp
Q
v
w
0.0256*
0.65*
0.0846 0.0965
0.0105 0.0181
0.0051 0.0091
2.15
0.26
0.13
0.2
2.45
0.46
0.23
-
0.0079
0.0079
0°
-
-
8°
0.2
-
e
θ
0°
8°
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: Pure tin plated.
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
DTC114YS3
CYStek Product Specification