Spec. No. : C303N3C
Issued Date : 2002.12.18
CYStech Electronics Corp.
Revised Date :
Page No. : 3/3
. .
SOT-23 Dimension
Diagram :
Marking :
A
L
3
3
A7_
S
B
1
2
1
2
_ : hFE Rank Code
3-Lead SOT-23 Plastic Surface Mounted Package
CYStek Package Code : N3
V
G
C
Style : Pin 1.Anode 2.Cathode
3.Common Connection
D
K
H
J
*:Typical
Inches
Millimeters
Inches
Min. Max.
Millimeters
DIM
DIM
Min.
Max.
Min.
Max.
3.04
1.60
1.30
0.50
2.30
0.10
Min.
0.85
0.32
0.85
2.10
0.25
Max.
0.177
0.67
1.15
2.75
0.65
A
B
C
D
G
H
0.1102 0.1204
0.0472 0.0630
0.0335 0.0512
0.0118 0.0197
0.0669 0.0910
0.0005 0.0040
2.80
1.20
0.89
0.30
1.70
0.013
J
K
L
0.0034 0.0070
0.0128 0.0266
0.0335 0.0453
0.0830 0.1083
0.0098 0.0256
S
V
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: 42 Alloy ; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
DAN217N3
CYStek Product Specification
CYSTEKEC [ CYSTECH ELECTONICS CORP. ]
