Spec. No. : C705P8
Issued Date : 2007.08.23
Revised Date :
CYStech Electronics Corp.
Page No. : 12/12
DIP-8P Dimension
Marking:
24BC □□
□□□□
Date Code
Memory:
1K: 01
2K: 02
4K: 04
8K:08
16K:16
DIP-8P Plastic Package
CYStek Package Code : P8
Inches
DIM
Millimeters
Min. Max.
Inches
Min.
0.008
0.355
0.240
0.300
Millimeters
DIM
Min.
-
Max.
Max.
0.011
0.400
0.280
0.325
Min.
Max.
0.279
10.16
7.112
8.255
A
A1
A2
b
0.021
-
-
0.5334
-
c1
D
E
E1
e
HE
L
0.203
9.017
6.096
7.620
0.015
0.115
0.014
0.014
0.045
0.030
0.008
0.381
2.921
0.356
0.356
1.143
0.762
0.203
0.195
0.022
0.020
0.046
0.045
0.014
4.953
0.559
0.508
1.778
1.143
0.356
b1
b2
b3
c
0.100 BSC
2.540BSC
-
0.430
0.150
-
10.92
3.810
0.115
2.921
Notes : 1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
CTK24BC01-16P8
CYStek Product Specification
CYSTEKEC [ CYSTECH ELECTONICS CORP. ]
